Intel plans to use its Foveros technology to stack chips vertically on its Lakefield SoCs.
Highlights:
- Intel demonstrated new 10nm Ice Lake CPUs at CES.
- 9th Gen Core series CPUs are coming to desktops and laptops this year.
- Intel also demonstrated its Lakefield 3D chip-stacking technology.
Intel made some interesting demonstrations at CES yesterday. In its keynote, the American technology company presented Ice Lake, its latest 10-nanometre processor that's based on the Sunny Cove architecture. In addition, it announced that it would begin shipping its 9th Gen Core series chips sometime this month. The range of the new-generation chips would start from the low-end Core i3 and go all the way up to the high-end Core i9. What's more, Intel presented a new CPU architecture called Lakefield, which involves three-dimensional stacking of chips to create a complete but low-footprint SoC.
Intel presented Ice Lake as a 'highly integrated platform' that combines a 10-nanometre processor with support for Thunderbolt 3, Wi-Fi 6, and DL Boost. During the CES demonstration, Intel placed two machines side by side to show the boost in speed while searching for images. According to the company, Ice Lake processors are 1.5 times faster than 8th Gen Core series CPUs. At the same time, Intel announced that its 9th Gen CPUs for desktop computers would start shipping later in the month.
Apart from Ice Lake, Intel also presented Lakefield, a 'Hybrid CPU' that's created using its new 3D chip-stacking technology. According to the company, a Core-series CPU core can be placed alongside several Atom-series CPU cores (all made using the 10nm process) on a larger SoC that houses I/O, memory, and graphics. The base die, compute chiplets, and DRAM layers are all stacked one on top of the other. Intel calls this packaging technology Foveros.
Lastly, Intel announced Project Athena, an innovation programme that defines a new set of industry specifications in order to bring about a new class of advanced laptops. Laptops under this programme will leverage 5G and artificial intelligence. They will be powered by the Intel Centrino platform for connectivity. From all that Intel announced at CES, one thing is for sure: we can expect to see laptops powered by 9th Gen Core CPUs later this year.
Related Read: 10 Crazy gadgets to watch out for at CES 2019
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