Xiaomi Mi 9 could also sport a triple rear camera setup with 48MP, 13MP and 16MP sensors, and could be the first phone to be powered by Qualcomm snapdragon 8150 chipset.
Last week, a report claimed that the Mi 9 flagship smartphone from Xiaomi could be the first handset to get a Qualcomm Snapdragon 8150 processor. A new development has now supported this claim and even delved out more information on the design of the smartphone. Tipster Ben Geskin has shared a render of next year’s rumoured flagship device on Twitter and listed its probable specifications.
The Xiaomi Mi 9 render shared by the tipster shows a notch which is is quite smaller than what we have seen on other Xiaomi devices. It is not a waterdrop notch as it houses a camera and another sensor. Geskin says that the smartphone could sport a 6.4-inch AMOLED display that will be equipped with an under-display fingerprint reader. The smartphone may be powered by the upcoming Snapdragon 8150 chipset and could be offered in three RAM variants: 6GB, 8GB and 10GB. The smartphone may have a glass back, it is expected to support wireless charging. The Mi 9 may be a 5G device.
When it comes to the camera, the smartphone could get a triple rear camera setup. The renders show an LED flash placed between the first two camera sensors and a third one below this setup. The primary camera of the unit may have a 48MP Sony IMX586 sensor the other two be be of 13MP and 16MP resolutions. The smartphone is claimed to be fueled by a 3,700mAh battery with Quick Charge 5.0 support. Previosuly, a report said that the Xiaomi Mi 9 will arrive in the first half of 2019 and, like the Mi 8, will apparently launch in China first.
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