The official render reveals the rear of Redmi K30 Pro.
The handset can be seen sporting a quad rear camera setup in a circular camera module.
Another teaser shows that the Redmi K30 Pro will have custom VC liquid cooling technology.
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Redmi K30 Pro is all set to be launched on March 24 in China. However, ahead of the launch, the company has released official render of the handset. Further, it is revealing K30 Pro features in bits and pieces. The latest teaser talks about the presence of a faster UFS 3.1 storage and LPDDR5 RAM. The phone is already confirmed to be powered by the Qualcomm Snapdragon 865 chipset.
The latest development comes from Weibo. Redmi has released several teasers on the Chinese social media platform. The Redmi K30 Pro has been confirmed to come with UFS 3.1 storage. It is claimed to deliver write speeds of up to 750 Mbps on the device. Redmi chief Lu Weibing says UFS 3.1 provides a greatly improved experience over the existing UFS 3.0. Further, it is teased to come with LPRDD5 RAM.
Another teaser shows that the Redmi K30 Pro will have custom VC liquid cooling technology. It is tipped to provide a promising heat dissipation performance using a 3,435 square millimetres of a liquid-cooled heat sink.
The official render reveals the rear of Redmi K30 Pro. The handset can be seen sporting a quad rear camera setup in a circular camera module. The render also reveals the top edge of the phone, which houses a 3.5mm audio jack, a pop-up camera module and what appears to be an IR sensor. We can also see the “64MP” branding at the center of the camera module. The Redmi K30 Pro is expected to sport the 64MPS Sony IMX686 primary shooter.
The handset is tipped to arrive in standard and Zoom Edition. The latter was first spotted in a recent MIUI 11 build and noticed by the folks over at XDA Developers. Soon enough, Redmi head Lu Weibing officially confirmed its existence on Chinese social media. It may feature 50x zoom capabilities.
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