We got a glimpse of a new Realme phone in a recent tweet shared by Realme CEO Madhav Sheth, and as per a previous story covered last week, the new phone seems to be the Realme X9.
Reports from GSMArena suggest that the new Realme phone will be the Realme X9. The back of the phone that was teased by Madhav Sheth seems to have taken the iridescent finish from the Realme V15 that was previously launched in China. The Realme X9 may even be the rebranded version of the V15.
As teased in the picture posted on Twitter, the CEO hints at the thickness of the device, and from it, we can gather that the phone is going to have a slim profile and will be omitting the 3.5mm jack from the phone. The phone could also come with MediaTek’s new Dimensity 1200 SoC. The phone also shows the slogan “Dare to Leap” printed on the back of the phone.
The bottom of the phone shows that it has a speaker grill and a Type-C port for charging, with no space for a 3.5mm jack. There is no confirmed date for the release of the phone yet, but given the teasers, the phone should be hitting the market soon.
In separate news, GSMArena also reports that a Realme X9 Pro is also in the works and will feature the new Dimensity 1200 SoC, the company has revealed to be introducing a phone with the Dimensity chipset, but no model number has been mentioned yet.