MediaTek’s next flagship SoC, the Helio X30, will be manufactured using a 10nm manufacturing process and boast ten physical cores, as suggested by leaks. Analyst Pan Jiutang, who made this claim, also stated that the upcoming chipset will be using ARM’s new generation Artemis cores. The Helio X30 will be configured in three core clusters, an Artemis cluster, an A53 cluster and an A35 cluster. This chipset is expected to handle 8GB of RAM, and can also be paired with a PowerVR GPU. In an image shared by Pan Jiutang on Weibo, the SoC allegedly scores 1,60,000 on AnTuTu. The chipset is expected to hit the markets in 2017.
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