The upcoming LeTV Max Pro is rumoured to have an ultrasonic fingerprint sensor and Iris recognition feature.
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Upcoming Chinese phone maker LeTV will be holding a press conference at CES 2016 on January 5, and rumours suggest that the company could announce the LeTV Max Pro smartphone at the event. The LeTV Max Pro is rumoured to offer an ultrasonic fingerprint sensor. It might also offer Iris recognition feature. The phone is likely to be powered by the Qualcomm Snapdragon 820 SoC, which supports all of these mentioned features.
Recently, Gizomchina reported that LeTV Max Pro was also seen on AnTuTu's website, where the device allegedly scored 1,33,000 points. However, that score seems a bit unreal. The rumoured specs, however, do seem plausible. The phone is suggested to have a 5.5-inch 2K display. Like mentioned, the phone will be powered by the Snapdragon 820. This upcoming Qualcomm chip is likely to power a majority of flagship smartphones in 2016. LeTV Max Pro is supposed to have 4GB of RAM and 64GB of on-board storage. It is also likely offer a 21MP on its back and a 4MP front facing camera.
The leaked image suggests that the phone could sport a curved edge design with 2.5D curved glass on the top. It is likely to run on Android Marshmallow 6.0 out of the box. If the specs are to believed, LeTV is likely to give other phone-makers a good competition.
The company has been doing good in their home country, China, and will be launching its devices in India, soon. The company is hosting a launch event here in India on the 5th of January, 2016. It is likely to introduce three phones — Le1, Le1 Pro and Le Max. The Le1 is powered by a MediaTek Helio X10 SoC. It has a 5.5-inch 1080p display, 3GB RAM, 13MP rear camera and 5MP front-facing camera. The Le1 Pro and Le1 Max, on the other hand, are powered by the Qualcomm Snapdragon 810 SoC, and come with 4GB of RAM. All of these three offer flagship-like specs, and are likely to be priced very competitively.
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