It looks like the specifications of the rumoured upcoming Sony Xperia SP have leaked before the official unveiling at MWC 2013.
Sony is expected to unveil the Xperia SP at MWC 2013 and as tradition has it, we have seen some information about the smartphone leak on the Internet ahead of the event.
The Xperia SP (C530X or ‘HuaShan’ as it is being called online) will be powered by a Qualcomm Snapdragon S4 Pro MSM8960T chipset with a 1.7GHz dual-core processor and it will have the Adreno 320 GPU. The 4.6-inch display of the smartphone is expected to have a 720p HD resolution. It also supports 8GB built-in storage expandable up to 32GB via a microSD card. The Xperia SP is expected to weigh 155 grams, and be 9.98mm thick.
Other information suggests that the Xperia SP will have a plastic back, but the rest of it will be built out of aluminium. The rear also has an 8MP Exmor RS camera sensor. Rumours mills also suggest that the transparent bar will be customized to show off notifications, unlike what we have seen with the transparent bars on other Xperia devices like the Xperia S in the past.
Sony is also expected to show off a 6.44-inch phablets at MWC 2013. The resolution of the massive display is expected to be 1920×1080 pixels. Sony along with Huawei is expected to unveil their phablets at MWC 2013 to take on the Samsung Galaxy Note II and the yet to launch Samsung Galaxy Note III. You can read more details about the Sony 6.44-inch phablets here.
