The Galaxy S9 is rumoured to come with a display technology as well as a miniaturised mainboard that will together free up a lot of physical space inside the phone and make it thinner and lighter.
With the launch of the Samsung Galaxy S9 looming large upon us, rumours and leaks are never-ending. We already had a pretty clear idea as to what this year’s flagship from Samsung will bring to the table. But new reports indicate there’s more than what meets the eye.
Per a new report from the reliable ET News, the upcoming Samsung Galaxy S9 and the Galaxy S9 Plus will ship with a new display type and a new mainboard technology.
The first is a display technology called Y-Octa (Youm On-Cell Touch AMOLED) technology that allows the touch sensor to be merged directly with the flexible OLED layer. This will make the phone much lighter and thinner apart from making the touchscreen more responsive. The technology was first showcased on the disastrous Samsung Galaxy Note 7.
The second is an introduction of SLP (Substrate Like PCB) mainboards that were first seen on the iPhone X. SLP is a technique to miniaturise circuit boards that will allow Samsung to have more space free inside the chassis. With the extra space, Samsung could fit a bigger battery or the phone may come with better cooling.
However, the report states the new technologies will only be used on Exynos variants of the Galaxy S9 and not on the Qualcomm variants. Due to an old licensing agreement, Samsung cannot sell phones powered by its own Exynos processors in the United States. So the Galaxy S9 will exclusively be powered by the Snapdragon 845 chipset which will not house the newer additions.
It should also be noted that the new features will not have a change in the exterior design of the phone. It is likely that the Galaxy S9 will look a lot similar to its predecessor and Samsung may not have to depend on its marketing team to give enough reasons for people to feel there’s something new in the upcoming flagships.
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