The new X24 Gigabit modem from Qualcomm is suggested to unveiled on Qualcomm’s Snapdragon 855 SoC, which might be manufactured on a 7nm process.
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Yesterday, Qualcomm announced an all-new X24 Gigabit modem for its upcoming SoCs. However, the biggest announcement was that the modem will be made on the 7nm manufacturing process. Today, known leakster Roland Quandt took to Twitter suggesting that the modem might make its debut on the Qualcomm Snapdragon 855 SoC. He also suggests that the next-gen flagship SoC might also be manufactured using the 7nm process.
Currently, there is only one fab maker we know of, who is working towards a 7nm process which is TSMC. The company is also reportedly working with AMD for its Zen 2 architecture, which is expected to manufacture using the 7nm manufacturing process. At CES this year AMD revealed that the company is on track and has completed its design phase.
We would see new phone launches based on the Qualcomm Snapdragon 845 SoC in the coming days this year. The new flagship class mobile chip is made using the new 10nm low power plus (LPP) process by Samsung. Samsung claims that the new process makes the chip 15% power efficient or can offer a performance bump of 10%.
Early rumors surrounding the alleged Snapdragon 855 SoC suggest that the chip might get official in 2019. Although, there is no info on whether TSMC is making the X24 modem as well. TSMC has already claimed a 40% reduction in power consumption and 37% increase in performance over the 10nm manufacturing process.
Qualcomm won't say it, but their contractors do. Snapdragon 855 (SDM855) is the first 7nm SoC. (probably the one the X24 modem ends up in) pic.twitter.com/Ot1J34fQoG— Roland Quandt (@rquandt) February 15, 2018
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