SLPs are considered to be the next generation solution for making smartphone motherboards. Samsung may be amongst the first to adopt them.
The Samsung Galaxy S9 is rumoured to sport a larger battery. According to etnews, Samsung might be using an ‘SLP (Substrate Like PCB)’ as the main board. This permits manufacturers to fit more components onto a single board by reducing their size, and allowing additional layers of components, while retaining the size of the board.
The SLP is considered the next-generation main board for smartphones and is the developed form of HDI (High Density Interconnect).
The report cites “industry sources” saying Samsung is preparing to use SLP boards, starting with the Galaxy S9, that will be released in 2018. Samsung is also planning on using SLP motherboards that connects major smartphone parts, including the NAND flash memory, AP (Application Processor) and DRAM. A PCB manufacturer told etnews, “We are making preparations for mass-production of SLPs in order to supply them to Samsung Electronics for its next Smartphone.”
According to the latest leaks, the Galaxy S9 lineup may have the same display sizes as the current Galaxy S8 series of smartphones. So, the standard Galaxy S9 is tipped to have a 5.77-inch display, while the larger Galaxy S9+ is expected to feature a 6.22-inch display. Both these devices are also expected to sport ‘Infinity’ displays that Samsung introduced this year, with dual-curved sides and minimal bezels on the top and bottom.
Some previous reports have suggested that Samsung has already started work on the Galaxy S9 and S9+, under the codenames ‘Star’ and ‘Star 2’. The two devices are expected to be powered by Qualcomm’s next generation of flagship processors, which may feature the 7nm fabrication process.
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Shubham Sharma
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