In an interesting turn of events, Intel has announced that its upcoming H-series of mobile processors will use custom graphics made by AMD. Intel has announced that it will use it's new EMIB (Embedded multi die Interconnect bridge) for the more powerful H-series mobile processors. This is a type of packaging solution which lets Intel put multiple silicon chips using the new efficient Interconnect method to combine everything on a single package. Intel states, that for the upcoming H-series family, Intel will be combining the might of its H-series cores, a custom design graphics chip by AMD and a second generation High Bandwidth Memory aka HBM2 in a single processor package.
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