Intel, at its Architecture Day event, announced some of its new technologies and innovations. Most notable of the lot was the announcement of a 3D logic chip packaging technology called “Foveros,” and the next generation ‘Sunny Cove’ architecture, upon which upcoming Intel chips will be manufactured. Foveros is said to enable logic-on-logic integration with 3D stacking to enable “high-performance, high-density and low-power” silicon process technologies. Meanwhile, Intel’s new CPU microarchitecture has been designed to increase performance per clock and power efficiency for general purpose computing tasks. It also focuses on new features that are aimed at improving tasks like AI and cryptography. Alongside the two major announcements, the chip maker also announced its next-generation Gen11 integrated graphics, the “One API” project, updates on Intel Optane technology, and released a Deep Learning Reference Stack for Xeon Scalable platforms.
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